Design Support
Related Documents
- ■Application Note
- ■Other
Features
-
・Low loss
・Ultrafast
・Thermal resistance package
Application
-
lFor PFC Circuit (CCM)
lFor White Goods
lFor Telecommunication Device, etc.
Specifications
IF | 20.0 A |
---|---|
IFSM | 150.00 A |
VRM | 200 V |
trr | 30 ns |
TJ | -40~150 ℃ |
VF | 1.05 V |
IR | 50 μA |
H・IR | 30.00 mA |
Thermal Resistance | 2.0 ℃/W |
Package Weight (Typ.) | g |
Physical Dimensions
Questions or Comments?
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