与传统产品相比，体积削减40%以上 高压三相电机驱动【SIM2-151A】
The SIM2-151A is a high voltage 3-phase motor driver in which transistors, pre-drive circuits, and bootstrap circuits (diodes and resistors) are highly integrated.
The new product comes in a compact DIP40 package and will best suit compressor-driven applications such as refrigerators and air conditioners.
Along with the lower-loss power elements, we successfully reduced the product’s mold volume by 40% or more compared to our conventional package through the DBC (Direct Bonding Copper) structure—whose excellent heat dissipation is a promising feature. The SIM2-151A also achieves the industry’s smallest size* among the high-voltage motor driver ICs rated for 15 A. The product is available in the package with not only a decreased volume size but also the heat dissipation equivalent of the conventional package.
We have currently been developing a device that can support 30 A with the same package.
* Based on our survey as of January 20, 2023.
Features
- Sufficient insulation distance:
Clearance: 2.788 mm (min.)
Creepage: 4.334 mm (min.) - Pb-free (RoHS compliant)
- Isolation voltage: 2000 V (for 1 min), UL-recognized (File No. E118037)
- Temperature sensing function
- Built-in bootstrap diodes with current limiting resistors (250 Ω)
- CMOS-compatible input (3.3 V or 5 V)
- Fault signal output at protection activation
Protections
- Undervoltage Lockout for power supply
High-side (UVLO_VB): auto-restart
Low-side (UVLO_VCC): auto-restart - Overcurrent Protection (OCP): auto-restart
- Thermal Shutdown (TSD): auto-restart, with an operating range of ±5 °C
Applications
For motor drives such as:- Refrigerator compressor motor
- Air conditioner compressor motor
Product Overview
| Part Number / Data Sheet | VCES | IC | Output Transistor | VCE(SAT)(Typ.) | Thermal Resistance | Package |
|---|---|---|---|---|---|---|
SIM2-151A  | 600 V | 15 A | FS-IGBT＋FRD | 1.6 V | 3.6 ℃/W |  DIP40 35.7×14.6×4.2 mm |
If you need to request samples or have any questions, please feel free to contact us using the form below.
The Industry’s Smallest Size* Attained by Ultra-compact DIP40 Package
Schematic View: DBC Structure
The SIM2-151A comes in an ultra-compact DIP40 package.
This package adopts the DBC (Direct Bonding Copper) structure to decrease its size (resin area) to 521 mm2 (35.7 mm x 14.6 mm).
The new product stands out for its package size, ≥40% smaller than that of our conventional IC (the SCM1272MA), and attains the industry’s smallest size*.
* Based on our survey as of January 20, 2023.
Package Guideline for High Voltage Motor Drivers
Enhanced Heat Dissipation
The SIM2-151A employs the DBC (Direct Bonding Copper) structure in which components like a chip can be placed directly on a substrate.
This structure allows the product to fit into the compact package yet has smaller thermal resistance, resulting in a thermally enhanced performance.
Ensured Clearance/Creepage
The SIM2-151A ensures sufficient insulation distance: a clearance of 2.788 mm (min.) between the high-voltage pins (COM－VB3), and a creepage of 4.334 mm (min.).
Precise Temperature Monitor
The SIM2-151A incorporates the temperature sensing function.
This function monitors the junction temperature of the internal control IC using a temperature-sensing voltage that the VT pin outputs.
With a variation of ±1.6% in junction temperature over temperature sensing voltage, the product boasts its preciseness equivalent to that of thermistor-mounted devices.
Thermal Shutdown (TSD)
The SIM2-151A has the thermal shutdown (TSD) function.
This function starts to operate when the internal control part exceeds the TSD operating temperature, TDH = 120 °C (typ.).
In addition, the TSD function is precisely designed so that the operating temperature varies within ±5 °C of its typical value.
If you need to request samples or have any questions, please feel free to contact us using the form below.