SIM2-151AB: High Voltage 3-phase Motor Driver
with a ≥40% Smaller Volume than Conventional

≥40% Smaller Volume than Conventional

The SIM2-151AB is a high voltage 3-phase motor driver in which transistors, pre-drive circuits, and bootstrap circuits (diodes and resistors) are highly integrated.
The new product comes in a compact DIP40 package and will best suit compressor-driven applications such as refrigerators and air conditioners.

Along with the lower-loss power elements, we successfully reduced the product’s mold volume by 40% or more compared to our conventional package through the DBC (Direct Bonding Copper) structure—whose excellent heat dissipation is a promising feature. The SIM2-151AB also achieves the industry’s smallest size* among the high-voltage motor driver ICs rated for 15 A. The product is available in the package with not only a decreased volume size but also the heat dissipation equivalent of the conventional package.

We have currently been developing a device that can support 30 A with the same package.

* Based on our survey as of January 20, 2023.


  • Sufficient insulation distance:
     Clearance: 2.788 mm (min.)
     Creepage: 4.334 mm (min.)
  • Pb-free (RoHS compliant)
  • Isolation voltage: 2000 V (for 1 min), UL-recognized (File No. E118037)
  • Temperature sensing function
  • Built-in bootstrap diodes with current limiting resistors (250 Ω)
  • CMOS-compatible input (3.3 V or 5 V)
  • Fault signal output at protection activation


  • Undervoltage Lockout for power supply
     High-side (UVLO_VB): auto-restart
     Low-side (UVLO_VCC): auto-restart
  • Overcurrent Protection (OCP): auto-restart
  • Thermal Shutdown (TSD): auto-restart, with an operating range of ±5 °C


For motor drives such as:
  • Refrigerator compressor motor
  • Air conditioner compressor motor

Product Overview

Part Number / Data SheetVCESICOutput TransistorVCE(SAT)(Typ.)Thermal ResistancePackage
SIM2-151AB 600 V15 AFS-IGBT+FRD1.6 V3.6 ℃/W
35.7×14.6×4.2 mm

If you need to request samples or have any questions, please feel free to contact us using the form below.

The Industry’s Smallest Size* Attained by Ultra-compact DIP40 Package

Schematic View: DBC Structure

The SIM2-151AB comes in an ultra-compact DIP40 package.
This package adopts the DBC (Direct Bonding Copper) structure to decrease its size (resin area) to 521 mm2 (35.7 mm x 14.6 mm).
The new product stands out for its package size, ≥40% smaller than that of our conventional IC (the SCM1272MA), and attains the industry’s smallest size*.

* Based on our survey as of January 20, 2023.

Package Guideline for High Voltage Motor Drivers

Enhanced Heat Dissipation

The SIM2-151AB employs the DBC (Direct Bonding Copper) structure in which components like a chip can be placed directly on a substrate.
This structure allows the product to fit into the compact package yet has smaller thermal resistance, resulting in a thermally enhanced performance.

Ensured Clearance/Creepage

The SIM2-151AB ensures sufficient insulation distance: a clearance of 2.788 mm (min.) between the high-voltage pins (COM-VB3), and a creepage of 4.334 mm (min.).

Precise Temperature Monitor

The SIM2-151AB incorporates the temperature sensing function.
This function monitors the junction temperature of the internal control IC using a temperature-sensing voltage that the VT pin outputs.
With a variation of ±1.6% in junction temperature over temperature sensing voltage, the product boasts its preciseness equivalent to that of thermistor-mounted devices.

Thermal Shutdown (TSD)

The SIM2-151AB has the thermal shutdown (TSD) function.
This function starts to operate when the internal control part exceeds the TSD operating temperature, TDH = 120 °C (typ.).
In addition, the TSD function is precisely designed so that the operating temperature varies within ±5 °C of its typical value.

If you need to request samples or have any questions, please feel free to contact us using the form below.

Questions or Comments?

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